The combination of multi-radio and multi-protocol solutions can accommodate two or more radios running different multi-protocols simultaneously on the same or different spectrums. Today, the market is driven to design products with multiple RF protocols in a box called a gateway. Wireless connectivity brings many different benefits, providing a better user experience, and different protocols provide complementary advantages. Each IoT device can communicate with the Internet through a different protocol, whether it is Zigbee, Bluetooth, Z-Wave or Sub-1ghz, or some proprietary protocol. Multi-protocol (wireless) gateways play a vital role in the IoT infrastructure because they collect data from the sensor field and push it to the Internet via Wi-Fi, cellular or other wired and wireless networks. The combination of multi-radio and multi-protocol solutions can accommodate two or more radios running different multi-protocols on the same or different spectrum simultaneously. This approach provides more efficient and reliable data flow by utilizing different protocols. Therefore, end users can take full advantage of this as they are able to connect multiple devices running on different RF bands and protocols through a single unit. Key Challenges in Designing Multiprotocol Compact RF Hardware The emergence of multi-protocol hardware is a response to the recent popularity of multiple different communication protocols. As a result, OEMs face some key challenges when designing multi-radio hardware:
Things to consider when developing firmware for multiradio hardware As IoT applications become more complex, the demand for storage capacity is also increasing. Let’s understand the challenges of hardware engineering solutions brought by memory and firmware:
Based on the above challenges, let's take a small example, a complex wearable/sensor/automation application may require 128 kB RAM and 512 kB flash provided by the RF module. A relatively simple beacon application may only require 24 kB RAM and 192 kB flash. To address the multi-radio hardware, memory, and firmware challenges described above, let’s look at how the OEM’s hardware expertise can be leveraged to address these challenges and help improve the overall performance of the product. The standard approach starts with a product understanding of all RF requirements and other peripherals, lists all RF interface protocol frequencies, and then performs a task such as module or SoC selection, relative antenna selection, identifying the housing with materials, module placement, and antennas. The early stages of PCB design will be 2D floor planning, which helps to understand the actual location and parameters of all RF modules in detail:
To reduce the coexistence and interference between two co-frequency modules, antenna placement plays a vital role. In this case, the antennas should be placed perpendicular to each other. We are working on proper isolation between the two RFs as per regulatory requirements, and the isolation between the two antennas should be equal to or greater than 30 dB. Sometimes, due to space constraints, it is not possible to achieve such isolation, in which case the interference and radiation pattern of all RF antennas need to be considered. We also need to study the transmit power of the RF module or SoC based on the application requirements and performance.
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